Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round to Address Most Pressing Challenge in Development of Generative AI Chips
3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional integrated passive solutions for radio frequency (RF), photonic and datacenters today announced the closing of a $30 million Series C financing. The round was led by Walden Catalyst Ventures, with participation from existing investors, including Intel Capital and Lockheed Martin Ventures, as well as new investments from Applied Ventures, LLC, Cambium Capital, and Mesh Cooperative Ventures.
3D Glass Solutions Closes $30 Million Series C Funding Round
3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional integrated passive solutions for radio frequency (RF), photonic and datacenters today announced the closing of a $30 million Series C financing. The round was led by Walden Catalyst Ventures, with participation from existing investors, including Intel Capital and Lockheed Martin Ventures, as well as new investments from Applied Ventures, LLC, Cambium Capital, and Mesh Cooperative Ventures.
Quadric Announces Completion of Series B Funding
Quadric, the general purpose neural processing unit (GPNPU) processor IP market leader, announced today an extension and completion of its Series B funding round, raising an additional $10M of equity and debt financing in addition to the $21M equity investment announced in February of this year. Xerox Ventures and Mesh Ventures are the latest investors to back Quadric’s innovative processor architecture, joining existing investors DENSO, MegaChips, Leawood VC, Pear VC, Uncork Capital, and Cota Capital.
Movellus Secures $23M in Series B Funding to Accelerate Growth
Movellus, today announced the closing of a $23M Series B to accelerate the company's growth. The funding will be used to expand R&D efforts and build out the marketing and sales functions to support the company's growth plans. MESH and SK hynix joined existing investors Accelerate Blue Fund, Candou Ventures, Hui Capital, Intel Capital, In-Q-Tel, Michigan Capital Network, Stata Ventures, and other private investors in this round.
Empower Announces a $45 Million Series C1 Financing to Fund Global Expansion and Development of Next-Generation Semiconductors
Empower Semiconductor, the world leader in Integrated Voltage Regulators (IVRs), has closed a $45 million equity financing led by Mesh Ventures and including existing investors Samsung Catalyst Fund, Hallador and Regal I. The financing will further accelerate the global expansion of its sales force and operational footprint as well as fund development of its next generation integrated voltage regulator (Empower IVR™) semiconductor technology.
Navitas Semiconductor to Go Public at an Enterprise Value of $1.04 Billion
Navitas Semiconductor (“the Company” or “Navitas”), the industry leader in GaN Power ICs, today announced that it has entered into a definitive agreement to combine with Live Oak Acquisition Corp. II (“Live Oak II”), a publicly-traded special-purpose acquisition company. The transaction, which values the combined entity at a pro forma equity value of $1.4 billion, will result in Navitas becoming a publicly-traded company on a national exchange under a new ticker symbol.