Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round to Address Most Pressing Challenge in Development of Generative AI Chips
Eliyan (“Eliyan”) Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced the closing of its latest funding round, totaling $60 million. The funding was co-led by Samsung Catalyst Fund and Tiger Global Management and includes participation from existing investors, including Intel Capital, as well as SK hynix, Cleveland Avenue and MESH, amongst others.