3D Glass Solutions Closes $30 Million Series C Funding Round

3D Glass Solutions Inc. (3DGS), a leading innovator of glass-based three-dimensional integrated passive solutions for radio frequency (RF), photonic and datacenters today announced the closing of a $30 million Series C financing. The round was led by Walden Catalyst Ventures, with participation from existing investors, including Intel Capital and Lockheed Martin Ventures, as well as new investments from Applied Ventures, LLC, Cambium Capital, and Mesh Cooperative Ventures

Previous
Previous

Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round to Address Most Pressing Challenge in Development of Generative AI Chips

Next
Next

Quadric Announces Completion of Series B Funding